| 摘要 |
The adhesive composition (34) in accordance with the invention for the hot bonding of substrates (32, 33), polymers or metals, comprises at least one polymer material, at least one plasticiser and wetting agent, and, possibly, at least one solvent, and its operating temperature is lower than the temperature at which the substrates (32, 33) degrade and lower than the melting temperature of polymer material.Application for making aeronautical quality sandwich structures, particularly for helicopter rotors.
|
