| 摘要 |
PURPOSE: Disclosed is a manufacturing method for low-cost mass production of hollow packages free from inflammation, fuming, discoloration and deformation and suitable for an overcurrent protecting device. CONSTITUTION: A large board(21) with a large number of element mounting parts is prepared. The board(21) has electrode parts(25,26) on the surface. The electrode parts(25,26) are connected by metallic fine wires(27) to form fuse elements. The peripheries of the element mounting parts are surrounded by column parts(41) to form recessed parts(24), and the metallic fine wires(27) are enclosed therein. After sealing the upper part airtightly with a cover body(31) for closing the recessed parts(24), the cover body(31) and the board(21) are cut in a lump for every element mounting part Disclosed is individual electronic components. |
