| 摘要 |
PROBLEM TO BE SOLVED: To form a highly reliable bump electrode by shaping the upper part of the bump electrode flat. SOLUTION: A bump electrode 7 formed at the electrode forming part of a semiconductor 4 device by wire bonding via an underlying metal of an aluminum layer 6 has residue of metal wire generated, when a wire is pulled off. The residue of metal wire is stamped from above by means of a stamping tool 9 while combining heat, ultrasonic wave and pressure to shape the upper of the bump electrode 7 flatly, thus obtaining a highly reliable bump electrode 7. |
