| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an optical semiconductor device, which is improved in coupling efficiency by having the size of an optical coupler element constituted in a chip structure reduced and improving the light receiving efficiency of a light-emitting element and can be mounted at high density. SOLUTION: An optical semiconductor device is provided with a package composed of a container-like substrate 10, having a multilayered structure and a cap 20 fixed to the opening of the substrate 10, a light-emitting element 2 mounted in the substrate 10, and a light-receiving element 3 mounted on the internal surface of the cap 20, in a state where the light receiving element 3 is faced opposite to the light-emitting element 2. A plurality of electrodes 111 for mounting is arranged in the package, in a state where the electrodes 111 are exposed only on one surface of the package and the light-emitting, and receiving elements 2 and 4 are respectively electrically connected to the electrodes 111 through conductive layers formed in the substrate 10 and cap 20.</p> |
