| 摘要 |
PROBLEM TO BE SOLVED: To realize reduction in manufacturing cost, improvement in reliability, and a thinner the product. SOLUTION: This optoelectronic device has a transparent glass substrate provided with a pad mounting plane 32, on which a prescribed circuit pattern and a 1st bonding pad 31 are formed. Plural through-holes for exposing 1st bonding pad 31 are drilled, also a 1st bonding surface 41 is bonded on the pad mounting plane 32 of the transparent glass substrate 3, a conductor housing space is formed between each of the 1st bonding pads 31 and a hole wall of the through-hole for exposing the 1st bonding pad 31, and this device is provided with an insulating tape 4 for attaching a conductive contactor 45 in each conductor housing space. Furthermore, this device is constructed by comprising a semiconductor chip 5, on which a 2nd bonding pad 52 to be electrically connected with the 1st bonding pad 31, is formed by being bonded to the conductive conactor 45 on a chip-mounting surface 51 to be bonded on the 2nd bonding surface of the insulating tape 4. |
