| 摘要 |
PROBLEM TO BE SOLVED: To prevent the dissolution of any copper plated film in manufacturing a built-up multi-layer substrate. SOLUTION: In a process for operating copper plating being a process for manufacturing a built-up multi-layer substrate, the crystal orientation property of a copper plated film 102 is controlled. That is, the crystal orientation property of the copper plated film 102 is controlled so that the rate of X-ray pattern diffraction strength I(111) of the (111) face of the copper plated film 102 to X-ray pattern diffraction strength I(220) of the (220) face of the copper plated film 102 can be set as I(220)/I(111)<0.2. Thus, in a process for roughening a resin surface 104 of the substrate by chrome acid, a copper plated film which is difficult to corrode can be formed. |
