发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the weight and direct material cost of a main circuit terminal for leads while the bonding characteristics to an aluminum wire internally connected to the terminal is improved for reliability. SOLUTION: A main circuit terminal is led out of the upper perimeter of a jacket resin case 1 where a circuit assembly 2 comprising a power semiconductor element 2a is housed. The main circuit terminal is internally connected to the circuit assembly with a bonding wire 8 of aluminum inside the case. Here, the main circuit terminal is an aluminum terminal 4A of an aluminum which is lighter and less expensive compared to a copper material while excellent in bonding characteristics to an aluminum wire, with at least an external lead-out part of the main circuit terminal plated with nickel 4A-1.
申请公布号 JP2001053222(A) 申请公布日期 2001.02.23
申请号 JP19990225538 申请日期 1999.08.09
申请人 FUJI ELECTRIC CO LTD 发明人 TOBA SUSUMU
分类号 H01L25/07;H01L23/28;H01L25/18;(IPC1-7):H01L25/07 主分类号 H01L25/07
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