发明名称 WIRING BOARD AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a wiring board and the manufacturing method, capable of pulling out signals with the small number of layers at the time of pulling out the signals from an LSI by matching the characteristic impedance of signal wiring, even in the case that the part of narrow width is present at a part of the signal wiring on the wiring board. SOLUTION: In this wiring board for constituting a strip line and a microstrip line holding an insulation part 30 between the signal wiring 10 and a conductor part 20, by providing a projection part 21 for the side of the insulation part 30 of the conductor part 20 facing the signal wiring 10 and adjusting the thickness of the insulation part 30 corresponding to the width of signal wiring, the characteristic impedance of the signal wiring 10 is matched.
申请公布号 JP2001053507(A) 申请公布日期 2001.02.23
申请号 JP19990229169 申请日期 1999.08.13
申请人 NEC CORP 发明人 CHIKAMICHI SHOICHI
分类号 H05K3/46;H01P3/08;H01P5/02 主分类号 H05K3/46
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