METHOD FOR MANUFACTURING WIRING BOARD AND ITS JIG

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board for holding the flatness of a resin layer and the jig. SOLUTION: An article 9 to be pressed is placed on a placement part P of a press jig 10 constituted by adhering strip plates 12 and 14 having thickness within the range of 100-105% of the target thickness of the article 9 to be pressed along the four sides of a large plate 11 so that the article 9 to be pressed can be pressed. In this case, the strip plates 12 and 14 are allowed to act as spacers so that the neighborhoods of the edge parts of the article 9 to be pressed can be prevented from being more excessively pressed than the neighborhoods of the central part. Thus, the flatness of a product due to the press result can be held.