MULTI-LAYER CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To improve the manufacture yield of a multi-layer circuit board by reducing the number of lamination of a circuit board, and to obtain a product with high reliability. SOLUTION: This multi-layer circuit substrate is formed of lands 10 arranged so as to be arrayed like a lattice at a mounted face side, and a circuit pattern whose one edge is connected with the lands 10 and whose other edge is pulled out from a plane region on which the lands 10 are arrayed to the outside. In this case, the lands 10 are arranged so that at least one part of the outer peripheral part of the plane region on which the lands 10 are arrayed can be projected or recessed at prescribed cycles.