| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting structure in an apparatus having a power module component, where the packaging density in a space above the power module component is raised and incorrect wirings are eliminated. SOLUTION: This mounting structure comprises a power module component 1, which has a plurality of input/output terminals 6 and a plurality of signal terminals 4 and radiates the heat of internal elements from the bottom surface, a means 9 for fixing the power module component 1 to a radiating base plate in order to radiate the heat from this component 1, a first printed board 3 disposed on the power module component 1, and a second printed board 7 disposed above the first printed board 3 via a space.
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