| 摘要 |
PROBLEM TO BE SOLVED: To realize a surface position detection method which can detect surface positions of a wafer in the circumferential exposure region of a wafer with high accuracy, even in a exposure region which is partially out of the wafer surface and in which the surface positions at some of measuring points cannot be measured. SOLUTION: A surface detection method includes a step, in which the average position 71 of measurable surface positions at measuring points corresponding to the wafer surface in a circumferential exposure region 22 of a water surface which is partially out of the wafer surface is obtained, a step in which a the difference between an average position 72 of surface positions at all measuring points in an inside exposure region 21 of the wafer surface, the entirely of which is within the wafer surface and the average position 73 of measurable surface positions at measuring points in the wafer circumferential exposure region in the exposure region 21 is obtained, and a step in which the difference is corrected and the surface positions in the circumferential exposure region of the wafer surface are obtained.
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