REFLOW SOLDERING MACHINE WITH ANTI-WARP NOZZLE

摘要

The present invention relates to a reflow soldering machine having an anti-warp nozzle and, more specifically, relates to a reflow soldering machine which has a nozzle to prevent a printed circuit board (PCB) from warping during a reflow soldering process for embedding electronic parts in the PCB. According to an embodiment of the present invention, the reflow soldering machine fixates the PCB to a conveyor through adhesion during a process of embedding electronic parts in the PCB by melting solder paste; thereby preventing warping or thermal deformation of the PCB due to high-temperature.