| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiating plate wherein, efficiently radiating the heat accumulated at a module, a deformation of a substrate caused by the difference in thermal expansion from a ceramic substrate is reduced even when directly jointed to the ceramic substrate. SOLUTION: Silicon carbide powder is mixed with phenol resin, which is compression-molded into a plate and then carbonized in vacuum (about 900 deg.C), and baked in vacuum at 1500-1700 deg.C. Or, silicon carbide powder is mixed with carbon powder, which is molded into a plate and then baked at 1500-1700 deg.C in vacuum so that a porous performs in formed. The perform contacts the ingot of high-purity metal silicon and is thermally processed at 1500-1700 deg.C in argon so that a molten metal silicon penetrates into the preform for reactive sintering with the phenol resin or carbon powder to form a silicon carbide. At the same time the voids in the preform is filled with the molten metal silicon to provide a tight heat radiation plate. The porosity of the heat radiation plate is preferred to be 10% or less for a sufficient heat conductivity. |
