| 摘要 |
PROBLEM TO BE SOLVED: To obtain a solder reflowing apparatus for improving the quality of soldering by heating a substrate on which parts are mounted, and a solder reflowing furnace system using the solder reflowing apparatus. SOLUTION: In this solder reflowing apparatus 100, a substrate P on which parts are mounted is placed on an in-furnace substrate carrying device 200, and inputted to a reflow furnace device 120 so that the substrate can be heated, and that the parts can be soldered. In this case, the carriage width of the in- furnace substrate carrying device 200 can be varied according to the width of each kind of substrate to be carried in with the central part of the heating temperature distribution of heaters 12 and 13 in the widthwise direction of the substrate as a reference according to the width of the substrate to be heated.
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