发明名称 RADIATION SENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a radiation sensitive resist composition capable of forming a resist pattern high in resolution and good in sectional forms and high in transmittance of F2 laser beams and suitable for a lithographic process of forming ultra-fine resist patterns having <=0.15 &mu;m by using F2 laser beams. SOLUTION: This radiation sensitive resist composition comprises (A) (a1) siloxane units having alkali-soluble groups, (a2) the siloxane (a1) units having the alkali-soluble groups substituted by acid-dissociable dissolution-restraining groups and (a3) the siloxane units having alkali-insoluble groups having no acid dissociable group, and (B) an acid generator made of compound to be induced to generate an acid by irradiation with radiation.
申请公布号 JP2001051422(A) 申请公布日期 2001.02.23
申请号 JP19990223750 申请日期 1999.08.06
申请人 TOKYO OHKA KOGYO CO LTD 发明人 OGATA TOSHIYUKI;KOMANO HIROSHI
分类号 H01L21/027;G03F7/039;G03F7/075 主分类号 H01L21/027
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