| 摘要 |
PROBLEM TO BE SOLVED: To prevent stresses from being applied to a junction between a connecting terminal and a board due to the thermal expansion of a resin filler, and to improve durability and reliability. SOLUTION: A board 7 and a sensor 14 are sealed in a board which houses a recess 4 of a casing 1, using a resin filler 16, the sensor 14 detects the number of revolutions of a gear 15 to output a detection signal from a signal processor 8 and a connection terminals 6, the resin filler 16 is constituted so that the total thermal expansion length composed of the thermal expansion lengths of its back side filling part 16B added to that of the board 7 is approximately equal to the thermal expansion length of an exposed part 6B of the connection terminal 6, thereby preventing stresses from being applied to a solder bond 13, due to the thermal expansion length difference between these members when the members expand thermally.
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