| 摘要 |
PROBLEM TO BE SOLVED: To improve the connection of an electromagnetic wave shielding material with an external electrode for grounding by laminating or burying a geometrically patterned conductive layer upon or in a plastic substrate and electrically connecting the conductive layer with a conductive frame section. SOLUTION: A geometric pattern 2 drawn by using a conductive metal is formed on a plastic film 3 through an adhesive layer or thin metallic film 4 and a conductive frame section 1 is formed of the conductive metal of a plastic film provided with the conductive film on the outer periphery of the pattern 2. In addition, a transparent layer 5 is laminated on the frame section 1 through an adhesive layer or thin metallic film in such a way that the whole surface of the frame section 1 is not covered, but the frame section 1 is exposed. Alternatively, the frame section 1 is exposed on the plastic film 3 side by bending the frame section 1 on the film 3 side. More alternatively, the geometric pattern 2 drawn by using the conductive metal is formed on the plastic film 3 through the adhesive layer or thin metallic film 4 and the frame section 1 is formed of a conductive material 6, such as the conductive adhesive, etc., on the outer periphery of the pattern 2.
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