HYBRID INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To greatly improve the coefficient of thermal conductivity of a hybrid integrated circuit board, by making the filler incorporated in a second insulating resin film to protrude from the surface of the insulating resin film and contain a first filler composed of a material that can be flattened. SOLUTION: A hybrid integrated circuit board 11 has rough metallic surfaces 12 and 13 respectively coated with first and second insulating resin films 14 and 16 on both sides. The first insulating resin film 14 incorporates a second filler 17 and the second insulating resin film 16 incorporates a second filler 18 and a first filler 19. The first filler 19 incorporated in the second insulating resin film 16 is protruded from the surface of the film 16 and composed of a material that can be flattened so as to reduce the frictional resistance of the board 11. Therefore, the coefficient of thermal conductivity of the board 11 can be improved significantly.