| 摘要 |
PROBLEM TO BE SOLVED: To obtain a flip-chip mount package which is improved in environmental resistance without using underfilling. SOLUTION: A chip 10 is connected and fixed onto a board 12 with bumps 14. A sheet 18 is provided thereon and fixed to the board 12 with adhesive agent 20 to shield the chip 10 from the outside air. After a packaging work is finished, when the device is introduced into a reflow oven, even if gas occluded in the device together with the chip 10 is thermally expanded, the flexible sheet 18 is deformed, so that cracking never occurs in the package. Therefore, the package does not breathe outside air through cracks, and no condensation is produced, so that the device can be prevented from deteriorating in reliability. |
