| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier which can enhance reliability of a wiring layer forming a Sn layer, and its manufacturing method. SOLUTION: In this tape carrier, there are formed an insulating film, a conveying sprocket hole 3 and a device hole 4 for mounting a semiconductor element, etc., in a two-layer tape comprising an insulating film 1 and a copper film 2. Next, with the use of photolithography technique, the copper film 2 is patterned to form a wiring layer 2a. Next, a Sn underlayer 5 is formed on the surface of the wiring layer 2a by a nonelectrolytic plating method. Next, a solder resist 6 is formed at a prescribed position on the Sn underlayer 5, and a Sn layer 7 is formed by electrolytic plating on the Sn underlayer 5, except for the solder resist 6, thereby obtaining a tape carrier 10.
|
