发明名称 METHOD FOR FIXING MOUNTING MEMBER TO PRINTED BOARD AND FIXING STRUCTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent protrusion of an underfill and roll-up formation of bubbles by bonding and fixing a mounting member (area terminal package) to a printed board with the underfill. SOLUTION: As shown in Figures (A1), (A2), a through-hole 5a is formed in advance on a printed board 5. As shown in figure (B), an area terminal package 1 is positioned below the printed board 5, and the through-hole 5a is covered from the lower side. When an underfill 4 as an adhesive agent having fluidity is poured from the through-hole 5a, the underfill 4 flows into a gap between the area terminal package 1 and the printed board 5 and the gap is filled with the underfill 4 and hardened.
申请公布号 JP2001053411(A) 申请公布日期 2001.02.23
申请号 JP19990229847 申请日期 1999.08.16
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 KITAHARA MASARU;JIGEN MASAHIRO;KUROSHIMA YUTAKA
分类号 H05K1/18;H01L21/56;H01L21/60;H05K1/14 主分类号 H05K1/18
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