RESIN COMPOSITION, SOLDERING RESIST RESIN COMPOSITION AND THEIR CURED BODIES

摘要

PROBLEM TO BE SOLVED: To provide a resin composition giving a cured body excellent in flexibility and resistance to the heat of soldering, heat deterioration and electroless gold plating, developable with an organic solvent or a dilute alkali solution and suitable for a soldering resist and for an interlayer dielectric. SOLUTION: The resin composition contains an unsaturated group-containing polycarboxylic acid resin (A) which is a reaction product of an epoxy resin (a-1) having two or more epoxy groups in one molecule, a monocarboxylic acid compound (b-1) having an ethylenically unsaturated group and a polybasic acid anhydride (c) and a carboxyl-containing oligomer (B) obtained by allowing a dicarboxylic acid compound (b-2) having an ethylenically unsaturated group to react with an epoxy compound (a-2) having two epoxy groups in one molecule.