| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin supply device, wherein while preventing clogging of a nozzle, a thermosetting resin is dripped on a heater in a stable state, which is evaporated evenly. SOLUTION: A nozzle opening 15 provided on the lower surface of a nozzle body 8, a resin path 11 communicating with a resin supply pipe 17 and the nozzle opening 15 is formed at the nozzle body 8 so that the path cross-sectional area is larger than that of the resin supply pipe 17. At the upper part of the resin path 11 of the nozzle body 8, a cooling liquid path 12 of a metal thin plate, which contacts most of the resin path 11 is formed via a diaphragm board 13. The cooling liquid path 12 is connected to cooling liquid charging discharging pipes 20a and 20b for circulating the cooling liquid to the outside.</p> |
