METHOD AND DEVICE FOR DETECTING POLISHING END POINT OF WAFER

摘要

PROBLEM TO BE SOLVED: To faithfully follow a polishing state for determining polishing end point detection by setting to a wafer CMP polishing end point when the digital value of an abrasive slurry waste liquid specimen at a CPM polishing end point where a read value is inputted to a control device in advance is reached. SOLUTION: The abrasive slurry waste liquid being collected by a scraper 27 for collecting the waste liquid of an abrasive slurry 13 on a polishing surface plate is pumped as successive flow for sending to a temperature regulator, and color developing reagents 20, 22, and 23 are successively supplied to abrasive slurry waste liquid flow being pumped by a roller pump 28. A digital value that is read by a color identification sensor for reading the color of an abrasive slurry waste liquid flow specimen containing the color developing reagent via a temperature regulator 29 as the digital value is compared with that being read by the color identification sensor of the abrasive slurry waste liquid flow specimen at a polishing end point where CMP polishing being inputted in a advance is made. Then, when a measurement value reaches a value being inputted in advance, a signal is generated for supporting the CPM polishing end of a wafer based on the signal.