| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method of manufacturing an electronic component, in which its element is corrected for misalignment, a bonding agent can be applied on the prescribed part of the element, and a bonding agent can be applied on a prescribed part corresponding to the elements of different lengths. SOLUTION: A bonding agent 10 is applied onto a pair of slopes 11a and 11b which form a V-shaped recess spreading upward, an element 1 is positioned above a V-shaped recess formed of the slopes 11a and 11b, and then the element 1 is made to descend to make its edges formed of the under surfaces and sides of its ends bear against the corresponding slopes 11a and 11b, by which the element 1 is corrected for misalignment, and bonding agent 10 is applied on the lower corners of the element 1.
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