| 摘要 |
PROBLEM TO BE SOLVED: To form a surface mounted unit which allows easy check of a mounted state of a surface mounted device on a printed board, even after the device is mounted on the printed board by disposing the unit so that it overhang the peripheral edge of a package of the surface mounted device. SOLUTION: Alignment patterns 23 formed on the side faces of a BGA device 21 are so disposed, that left and right boundary lines 50a, 50b of each alignment pattern 23 are on the same lines as left and right boundary lines 51a, 51b of each position indication land 24 formed on a printed board 22. In this state, solder balls 3 and a cream solder 5 on the lands 24 are melted by a reflow connection method, etc., and then are cooled to be connected to each other, resulting in completed connection between each of the solder balls 3 and the cream solder 5 on the lands 4 without deviations in positions. Accordingly, by merely checking by visual inspection whether the left and right boundary lines 50a, 50b of each alignment pattern 23 and the left and right boundary lines 51a, 51b of each position indication land 24 are on the same lines, a mounted state can be checked of its guality.
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