UNSEALING DEVICE AND METHOD OF RESIN-SEALED BODY

摘要

PROBLEM TO BE SOLVED: To obtain an unsealing device which is capable of easily carrying out a mechanical digging process where a sealing resin layer of very small thickness is left unremoved and preventing an adverse effect of cuttings caused by digging. SOLUTION: An unsealing device is equipped with an X-ray irradiation part 2 and an X-ray reception part 3 both provided inside an X-ray vessel 1, where an integrated circuit 5 is held with a sample stage 4 so as to shut out an optical path between the X-ray irradiation part 2 and X-ray reception part 3. Furthermore, the unsealing device is equipped with drills 6 and 6a which dig mechanically for unsealing and suction parts 7 and 8 which remove cuttings produced at digging.