| 摘要 |
PROBLEM TO BE SOLVED: To automate a semiconductor inspection process, comprising the steps of defect inspection, defect location and defect characteristics analysis by forming a plurality of alignment marks on the outer circumference of a wafer before machining and converting the coordinates between an inspection tool and a characteristics analyzing tool with reference to on alignment mark. SOLUTION: Before a wafer is machined through an IC fabrication process, a plurality of alignment marks for location are formed on the outer circumference of the wafer. A machined wafer is inspected by means of an inspection tool and transferred to a characteristics analyzing tool for location. Defect position in the coordinate system of the inspection tool is converted into the coordinate system of the characteristics analyzing tool with reference to the alignment mark, so that the defect can be located easily and utilized in the characteristics analysis by means of the characteristics analyzing tool, thus automating the semiconductor inspection process.
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