| 摘要 |
The present invention relates to a laser machining apparatus capable of simultaneously forming holes at a plurality of positions without generating cracks. The laser machining apparatus comprises: a chuck table which maintains a processing object on an XY plane; and a laser beam irradiation means which irradiates the processing object maintained on the chuck table with a laser beam. The laser beam irradiation means includes a pulse laser beam oscillation means which oscillates a pulse laser beam at repetition frequency M, a condenser which condenses the pulse laser beam oscillated by the pulse laser beam oscillation means, and irradiates the processing object maintained on the chuck table, and a pulse dispersion means which is disposed and formed between the pulse laser beam oscillation means and the condenser, and disperses the pulse laser beam on a plurality of X coordinates and a plurality of Y coordinates, and the pulse dispersion means includes a mirror which reflects the pulse laser beam oscillated at the repetition frequency M, and includes a scanner which fluctuates at repetition frequency M1 lower than the repetition frequency M and disperses the pulse laser beam on (M/M1) coordinates. |
