| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor manufacturing apparatus which can eliminate the need for screw tighting an electrode plate to an electrode main body of an upper electrode, can closely contact the plate to the main body uniformly on their full surfaces without position shift, can facilitate exchange work of the electrode plate, and can suppress variations in temperature. SOLUTION: An upper electrode includes a cooling block 8 surrounded by an outer frame 7 and a cooling plate 9. The plate 9 of an electrode main body 6a having a gas chamber 10 defined by the block 8 and plate 9 therein is formed at its lower end with an ring flange 17a, in order to be tightly contacted with a uniform pushing force with an electrode plate 12 of special carbon having a multiplicity of slots 12a formed therein. The electrode has an electrode holding cylinder 17a of quartz slidably fitted in an outer periphery of an outer frame 7 and an engagement part 17a provided at one end. The electrode also has a leaf spring 18 fixed at its other end to the cylinder 17 for engaging an engagement part 18a with a recess 7a made in the other frame 7 to energize the cylinder 17 upwards, and a positioning pin 16 embedded in an abutment surface against the electrode plate 12 of the cooling plate 9 for prevention of its positional deviation. |
