FORMATION OF BUMP ELECTRODE

摘要

PROBLEM TO BE SOLVED: To obtain a method for forming bump electrodes in which the cost required for forming bump electrodes can be reduced by coating conductive pads formed on the surface of a semiconductor substrate with flux at low cost. SOLUTION: Conductive pads 2 formed on the surface of a wafer 1 is coated with soldering flux 3 by means of an ink jet unit 4. Since only required parts can be coated with flux 3 using the ink jet unit 4, only the conductive pads 2 can be coated with flux without requiring an expensive photomask or optical system.