发明名称 PROCESSING APPARATUS AND PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a processing apparatus in which a substrate processing chamber is small and substrates can be easily delivered, and moreover, the substrates can be protected from being contaminated. SOLUTION: A cleaning device is provided with a carrier conveying table for conveying carriers capable of housing wafers W, a wafer-conveying arm 8 for conveying the wafers W, a rotor 30 for holding the wafers W, an external cleaning chamber 31 and an internal cleaning chamber 32 both for housing the wafer held by the rotor 30 to process them, and a wafer hand 33 for transferring the wafers W. The wafer hand 33 moves capable of lifting and lowering between a delivery part 34 for delivering the wafers from/to the wafer hand 33 and a stand-by part 35 for making the wafer hand 33 wait.
申请公布号 JP2001053129(A) 申请公布日期 2001.02.23
申请号 JP19990229319 申请日期 1999.08.13
申请人 TOKYO ELECTRON LTD 发明人 KAMIKAWA YUJI;EGASHIRA KOJI
分类号 H01L21/677;H01L21/304;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 H01L21/677
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