METHOD OF POSITIONING DICING LINES

摘要

PROBLEM TO BE SOLVED: To provide a method of positioning dicing lines so that degradation of positioning accuracy due to abrasion of a dicer blade does not occur upon die bonding. SOLUTION: A chip 10 is diced with reference to the left side edge 12 and the lower side edge 14 thereof. A thin line 16 indicates a chip edge position when the chip is diced with a new blade. A thick line 18 indicates a chip edge position when the chip is diced with a worn blade. When the chip 10 thus diced is bonded on a die, the chip is positioned by a pusher of a die bonder so that the left side edge 12 and the lower side edge 14 of the chip are aligned to certain positions.