| 摘要 |
PROBLEM TO BE SOLVED: To uniformly lower the temperature of an LSI efficiently by directly soldering and fixing the sealing top plate of a multichip module, in which a cooling flow-path channel is formed, to the rear of a semiconductor device. SOLUTION: Metalized layers 6 are formed at a position where the rear 24 of a sealing top plate 20, in which a cooling flow-path channel 21 is formed, and the rear 5 of the semiconductor device 10 are faced mutually. Sections among each metalized layer 6 are fixed by soldered joints 26 in the sealing top plate 20 and the semiconductor device 10. Accordingly, the generated heat of LSI chips 1 is passed in microchips, the soldered joints 26 and the sealing top plate 20, and discharged efficiently to a cooling fluid in the cooling flow-path channel 21. Thus, the heat capacity of the sealing top plate 20 can be limited to a small value, thermal strain generated in the case of a temperature rise by heating and in the case of a temperature drop by cooling can be reduced, and productivity such as the assembling properties, disassembling properties or the like of the multichip module can be improved.
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