| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package for a semiconductor device, which does not generate cracks due to stress and can improve I/O isolation characteristic. SOLUTION: An inner wall surface in a lead penetration part of a sidewall part 10d, disposed in upright around a chip mounting region, is positioned on the same surface as the inner wall surface of a ceramic part 15a formed in the lead penetration part. On the interface between the ceramic part 15a and the inner wall surface 17 of the sidewall part 10d, a gap 16 is so formed that airtightness of a space forming the chip-mounting region is ensured. |
