摘要 |
<p>PROBLEM TO BE SOLVED: To suppress the electromagnetic radiation from electronics by laminating ground layers upon both the top and bottom sides of a power supply layer provided with power supply wiring respectively through first insulating material layers and signal layers provided with signal wiring upon one or both of the top and bottom sides of the power supply layer respectively through second insulating material layers. SOLUTION: A multilayered printed board is constituted by successively forming a signal layer 3, a basic insulating material layer 5, a ground layer 2, an power supply insulating material layer 4, and power supply layer 1 from the top side to the bottom side and, under the power supply layer 1, a poser supply insulating material layer 4, a ground layer 2, a basic insulating layer 5, and a signal layer 3 from the top side to the bottom side. In this arrangement, ideal DC power can be apparently individually supplied to circuit elements mounted on the printed board. Therefore, the restrictive factor to the high-speed operations of the circuit elements from a power supply section can be eliminated and, at the same time, the electromagnetic coupling between the power supply line and signal line of the printed board to which high-frequency currents flow and the flowing-out the high-frequency current from the power supply line of the printed board to a power supply cable in a device can be suppressed.</p> |