发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing it, where hydrogen is prevented from remaining in a gate insulating film, interface mismatching is restrained from occurring in the gate insulating film, and a transistor can be prevented from varying in a threshold voltage and decreasing in an ON-state current. SOLUTION: A semiconductor device is equipped with a gate electrode formed on a silicon substrate 11 through the intermediary of a gate insulating film 12, where the gate insulating film 12 is formed of silicon oxide nitride film of one-layered structure where oxygen atoms are mixed and distributed in nitrogen atoms. Oxygen atoms are distributed uniformly or gently in concentration in the gate insulating film 12 within a certain range in the thickness direction of the film continuously from its interface with the silicon substrate to the top surface.
申请公布号 JP2001053073(A) 申请公布日期 2001.02.23
申请号 JP19990226192 申请日期 1999.08.10
申请人 NEC CORP 发明人 HASEGAWA EIJI
分类号 H01L29/78;H01L21/28;H01L21/318;H01L29/51;(IPC1-7):H01L21/318 主分类号 H01L29/78
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