| 摘要 |
PROBLEM TO BE SOLVED: To obtain a probe card, in which an object to be inspected can be conducted electrically with a small probe pressure, while preventing adhesion of impurities to a probe by providing a blade part having a substantially arcuate forward end at the forward end of the probe. SOLUTION: When a wafer W is inspected using a probe 31, the wafer W is overdriven and an edge 31B of a blade part 31A touches the substantially central part of an electrode pad P and then bites into the pad P. Since the edge 31B is arcuate, it can bite into the pad P with a smaller probe pressure as compared with a conventional case. Since the blade part 31A does not cut off the pad P, chips do not adhere to the blade plane 31C. Even if impurities adhering to the surface of the pad P adhere to the probe 31, when the probe 31 separates from the pad P, the impurities are removed from the blade plane 31C when the probe 31 bite into a next pad P.
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