| 摘要 |
PROBLEM TO BE SOLVED: To realize an application technique which is capable of applying resin uniformly over the whole work. SOLUTION: A resin applicator 31 is moved by controlling an XY table 22, and a nozzle 38 is arranged at the end of a window hole 6 provided in a tape carrier 2. Air 34 is fed to a syringe 32 with an air feeder 36, a resin applicator 31 is horizontally displaced along the window hole 6 with the XY table 22, and potting material is applied on a chip 10 conforming to the window hole 6. In this case, the air pressure 34 is controlled by the air feeder 36 corresponding to the traveling speed of the resin applicator 31, by which the amount of coating of potting material 30 per unit area is uniformly controlled during all resin applying process where a resin applicator is accelerated to start coating, keeping coating accelerated and decelerated to stop coating. By this setup, excess potting material can be prevented from spreading to the side and under surface of a chip, so that the chip is prevented from deteriorating in external appearance due to potting material sticking to the unnecessary parts of the chip.
|
