DEVICE FOR TREATING WAFERS

摘要

The invention relates to an device for treating wafers. Said device comprises a system of production units (1) in a clean room (2) and a supply system for supplying and discharging process liquids and/or gases for the production units (1). Said supply system is provided with first supply ducts (7a) and discharge ducts (8a) in which process liquids and/or gases that are heavier than the ambient atmosphere are guided from the top towards the bottom and second supply ducts (7b) and discharge ducts (8b) in which the lighter process liquids and/or gases are guided from the bottom towards the top.