| 摘要 |
<p>A photocurable resin composition for sealing materials which comprises (A) a compound having an oxetane ring, (B) a cationic photopolymerization initiator, and (C) a silane coupling agent and has a viscosity at 25°C of 0.01 to 300 Pa.s. This composition can be cured at low temperatures, is excellent in photosensitivity, rapid-setting properties, and adhesion, gives a cured resin having high adhesion strength and highly impermeable to moisture, and has satisfactory productivity. Also provided are a sealing material comprising the photocurable resin composition and a method of sealing with the sealing material. The method is suitable for sealing flat panels such as a liquid-crystal panel and an electroluminescent display.</p> |
