发明名称 HIGH DENSITY ELECTRICAL INTERCONNECT SYSTEM HAVING ENHANCED GROUNDING AND CROSS-TALK REDUCTION CAPABILITY
摘要 <p>The present invention provides an electrical interconnect system using multiple grounding methods to reduce or prevent spurious signals from interfering with high density contacts carrying high speed transmissions. A first connector includes an insulative pillar partially surrounded by a plurality of signal contacts. A central ground contact is at least partially located within the insulative pillar. A second connector includes a plurality of flexible signal contacts for mating with the signal contacts adjacent the insulative pillar. The second connector also includes a central ground contact for receiving the central ground contact of the first connector. The ground contacts provide a first method of providing a ground path to reduce spurious signals from entering the signal path.</p>
申请公布号 WO2001013468(A2) 申请公布日期 2001.02.22
申请号 US2000022534 申请日期 2000.08.17
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