Liquid processing method used in the production of a semiconductor device comprises adding liquid to the object to be processed, contacting with a treatment fluid and removing the treatment fluid

摘要

Liquid processing method comprises a feed step in which a processing liquid is added to the object to be processed; a contacting step in which the surface of the object is contacted with a treatment fluid; and a removal step in which the treatment fluid is removed from the object. The contacting step and the removal steps are repeated. Preferred Features: The object is a substrate. The removal step is carried out when the activity of the treatment fluid is lower than the activity of a non-reacted treatment fluid.