发明名称 Semiconductor device used as a DRAM of a capacitor-over-bitline has a lower insulating layer covering source/drain regions, an upper insulating layer and storage node contacts
摘要 Semiconductor device has a lower insulating layer (6) covering source/drain regions (5) electrically connected to capacitors (14); an upper insulating layer (7, 10) lying above the lower insulating layer, and storage node contacts (11) which penetrate the lower and upper insulating layers and reach the source-drain regions. The whole surfaces of the source/drain regions containing regions open into which the nodes open out are essentially flat. An Independent claim is also included for a process for the production of the semiconductor device. Preferred Features: The upper insulating layer is a silicon oxide layer and the lower insulating layer is a silicon nitride layer.
申请公布号 DE10024361(A1) 申请公布日期 2001.02.22
申请号 DE20001024361 申请日期 2000.05.17
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO 发明人 MATSUOKA, TAKERU;TSUKAMOTO, KAZUHIRO
分类号 H01L27/108;H01L21/8242;(IPC1-7):H01L27/108;H01L21/824 主分类号 H01L27/108
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