| 摘要 |
<p>A pattern inspection device and pattern inspection method capable of recognizing abnormal sizes and detecting the defects of figures to be detected with high accuracy irrespective of the number of measuring elements available. The inspection method is outlined below: a wiring pattern of a printed circuit board is read, and a small critical circle (51) and a large critical circle (52) are assigned to a binarized pattern image. In this case, if all the pixels in an area (53) inside the small critical circle (51) are 'dark' and all the pixels in an area (54) along the outside of the large critical circle (52) are 'bright', dark pixels in the area (53) and dark pixels continuous to them are recognized as holes. If even one of a condition inside the small critical circle (51) and a condition outside the large critical circle (52) is not satisfied, it is assumed that no hole is available.</p> |
