发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>The present invention relates to a photosensitive resin composition capable of being developed by an alkaline aqueous solution, and provides a photosensitive resin which has superior resolving power by having a chemical bond between a binder resin and a crosslinking compound as well as a chemical bond between binder resin chains at an exposed area during an exposure process, thus maximizing a solubility difference between an exposed area and a non-exposed area during a developing process, and which has process benefits as well as superior film characteristics by reducing a consumed amount of a crosslinking compound, thus minimizing total amount of UV irradiation necessary.</p>
申请公布号 WO2001013175(A2) 申请公布日期 2001.02.22
申请号 KR2000000883 申请日期 2000.08.10
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