| 摘要 |
<p>A multilayer printed wiring board free from cracks attributed to the difference in thermal expansion between a solder resist layer and another portion. The multilayer printed wiring board comprises a base (1), conductor circuits (4, 5) and a resin insulating layer (2) formed on the base (1) in order, and an outermost layer of a solder resist layer (14), characterized in that the solder resist layer contains an inorganic filler.</p> |
