INDUCTIVELY COUPLED PLASMA PROCESS CHAMBER WITH SHIELD ELECTRODE INTERPOSED BETWEEN ANTENNA AND DIELECTRIC WINDOW

摘要

The present invention provides a process chamber and voltage distribution electrode (VDE) (120) which distributes capacitive coupling between an inductive source (119) and a plasma in a process chamber (110). The VDE is preferably slotted defining energy opaque and energy transparent portions which enable inductive coupling into the chamber while distributing capacitive coupling uniformly over the dielectric window (112). The VDE can be switched between an electrically floating configuration, a grounded configuration, or a powered configuration.