| 摘要 |
Nonvolatile memory cell and process in which isolation oxide regions are formed on opposite sides of an active area in a substrate to a height above the substrate on the order of 80 to 160 percent of the width of the active area, a first layer of silicon is deposited on the gate oxide and along the sides of the isolation oxide regions to form a floating gate having a bottom wall which is substantially coextensive with the gate oxide and side walls having a height on the order of 80 to 160 percent of the width of the bottom wall, a dielectric film is formed on the floating gate, and a second layer of silicon is deposited on the dielectric film and patterned to form a control gate. |
